Author: Registered User

Copper Etchant

(TKCE493,492),(TKCESD100),(TKCEAP100)
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FEATURES
Ready - to - use
Highly compatible with widely used photoresists
Etches copper with straight sides
Easily processed

DESCRIPTION
Copper Etchants (TKCESD100)basic formular :
Ferric chloride solutions(proprietary wetting antifoam + chelating additives)
Copper, copper alloys and Kovar의 printed circuit board applications 에 가장 최적화.
Photoresists (KPR, DYNACHEM, AZ, RISTON, SCREEN RESISTS, etc.) 에 최적의 호환성.
Solder-plated resists 적용 시 사용 할 수 없음.
TKCEAP100 Copper Etchant는 thin film circuit에 적합한 fine line definition. nickel과 tin-lead solder에 호환.
Copper Etchant (TKCE493)는 gallium arsenide ,copper의 Nanoelectronic etch application에 Etch Rate 조절 용이.
Copper Etchant(TKCE493)은 solder material -100% tin, tin 97%-silver 3% ,gold, nickel, and nickel-vanadium alloys.

COPPER ETCHANTS

Model	TKCESD100	TKCEAP100	TKCE493
Appearance	Deep purple Liquid	Clear, colorless Liquid	Clear, colorless Liquid
Etchant Type	Immersion(Dip) / Spray	Immersion(Dip) / Spray	Immersion(Dip) / Spray
Operating Temperature	20 - 40 ℃	20 - 40 ℃	20 - 40 ℃
Etch Rate @ 40℃	1 mil/min	80Å/sec	22Å/sec
Time to etch 1 oz, copper	1 1/2 min	7 1/2 min	20-30 wafers/gallon
pH range	1 이하	1 이하	5 - 6.5
Select Compatible Materials	Au, oxide, nitride, alumina	Au, oxide, nitride, alumina	Au, Ti, oxide, nitride, Si, Ni
Select Incompatible Materials	Al, Ni, Ti	Al, Ni	III족원소- V족원소
Etch Capacity	19 oz. Cu/Gal	10 oz. Cu/Gal
Shelf Life	1 year	1 year	1 year

Etch 호환성(Compatibility)

	TKCESD100
Etch	Al	Co	ZnO	Cu	Fe	GaAs	Mg	MgO	Ni	Pd	Steel
No Etch(20:1 이상)선택성	Al2O3	Au	C	Nb	Pt	Ru	Si	Si3N4	SiO2	Ta/TaN	W
Slight(20:1이하) 선택성	Ti	Cr

	TKCEAP100
Etch	Cu	Ni
No Etch(20:1 이상)선택성	Al	Al2O3	Au, C	Cr	Fe, Mg	Pd, Ru	Si, SiO2	Si3N4	Steel, Ta	Ti/ZnO
Slight(20:1이하) 선택성	W

	TKCE493
Etch	Cu	GaAs
No Etch(20:1 이상)선택성	Al	Au	Cr	Ni	Si	Ti	W	Si3N4	SiO2	Ta/TaN
Slight(20:1이하) 선택성	Ti	Cr

APPLICATION
Copper Immersion Etchant (TKCESD100/TKCEAP100/TKCE493)는 바로 사용할 수 있음. Microelectronic/Nanoelectronic surface etch layered copper camber/bath 를 장착한 장비 cleaning. Copper Immersion Etchant (TKCESD100)는 Graphene Process Copper Etchant(TKCE493)은 두께가 얇은 Micro Thin Film의 Etch Rate 조절
ETCHING TANK / EQUIPMENT/ PACKAGE
Packing : HDPE, glass, or epoxy-coated tanks.
Heaters may be quartz, carbon or titanium (nickel or cobalt-steel).
Unit :Galon(3.78 L) , 20 Liter.
DISPOSAL OF SPENT ETCHANT
사용된 etchant(TKCESD100)는 탄산칼슘(calcium carbonate)으로 중화시킨 후 물로 희석 후 폐기.
하수구 배출은 추천않음.
배출은 유해화학물질 폐기에 관한 관련 법률에 따라 폐기.
유해화학물질 관련 수질환경에 관한 법률에 따라 처리.

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