Technical Collaboration R&D Center

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Application-Based Product Selection

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Target ¸·Áú°ú °øÁ¤ ¸ñÀûÀ» ±â¹ÝÀ¸·Î ÀûÇÕÇÑ Etchant¡¤Cleaning Solution¡¤Advanced Materials ¹× °ü·Ã ºÎǰ¡¤Àåºñ¸¦ Á¦¾ÈÇÕ´Ï´Ù. Ãʱ⠿¬±¸ ´Ü°è¿¡´Â ¸ÂÃãÇü Á¦Ç° ¼±Á¤°ú ¼Ò·® R&D Starter KitÀ» Áö¿øÇÕ´Ï´Ù.

STEP 01. SELECT TARGET MATERIAL

Available Models:
Standard / Reference Etch Rate
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´ëÇ¥°ªÀÌ¸ç ½ÇÁ¦ ½Ä°¢¼Óµµ´Â ¸·Áú¡¤¿Âµµ¡¤³óµµ¡¤±³¹Ý Á¶°Ç¿¡ µû¶ó ´Þ¶óÁú ¼ö ÀÖ½À´Ï´Ù.

Nano Thin-Film Wet Etching
Nano / Thin-Film Wet Etching ¡¤ Application Visualization

Product Documents

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Á¦Ç° Catalog TDS SDS

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SELECTIVITY MATRIX Target / Underlayer Compatibility

¡Ü ETCH¡Ü SAFE

¡Ø ´ëÇ¥ Àç·á ȣȯ¼º Á¤º¸ÀÌ¸ç ½ÇÁ¦ °á°ú´Â ¸·Áú ¹× °øÁ¤Á¶°Ç¿¡ µû¶ó ´Þ¶óÁú ¼ö ÀÖ½À´Ï´Ù.

Key Applications

    Application ÀÚ·á

    APPLICATION

    Application & Process Support

    Á¦Ç°¸íÀÌ È®Á¤µÇÁö ¾Ê¾Æµµ Target film, underlayer, °øÁ¤ ¸ñÀû°ú ¿ä±¸ Ư¼ºÀ» ±âÁØÀ¸·Î Á¦Ç° ¼±Á¤°ú Ãʱ⠰øÁ¤Á¶°ÇÀ» °ËÅäÇÕ´Ï´Ù.

    01

    Pattern Etching

    Etch Rate, Uniformity, Undercut¸¦ °í·ÁÇÑ ±Ý¼Ó ¹Ú¸· ÆÐÅÍ´×.

    02

    Selective Etching

    Target/Underlayer Á¶ÇÕ, Selectivity ¹× Àç·á ȣȯ¼º °ËÅä.

    03

    Cleaning & Residue

    °øÁ¤ ÈÄ Residue, Particle ¹× Ç¥¸é ¿À¿° Àú°¨ ¼Ö·ç¼Ç.

    04

    Surface & Process Window

    Roughness, Surface Quality¿Í °øÁ¤ ¾ÈÁ¤¼º °ËÅä.

    R&D SUPPORT ¡¤ NEW

    1 L

    R&D Starter Kit - 1 L

    Wet EtchingÀ» óÀ½ ½ÃÀÛÇϰųª ¼Ò·® ÃÊ±â Æò°¡°¡ ÇÊ¿äÇÑ ¿¬±¸ÀÚ¸¦ À§ÇÑ °£Æí ¿¬±¸Áö¿ø KitÀÔ´Ï´Ù.

    Etchant 1 L
    Basic Experiment Support
    Quick Guide + TDS/SDS
    • Research Etchant 1 L
    • Á¦Ç°/Application¿¡ ÀûÇÕÇÑ ±âº» ½ÇÇèÁö¿ø µµ±¸ ¶Ç´Â ±ÇÀå ±¸¼º
    • ±âº» °è·®¡¤ÀÌ¼Û ¼Ò¸ðǰ ¾È³»
    • TDS / SDS ¹× Quick Start & Application Guide
    • Ãʱ⠰øÁ¤Á¶°Ç »ó´ã
    STANDARD SUPPLY

    ±âÁ¸ ÀÏ¹Ý °ø±Þ

    ¹Ýº¹ »ç¿ë ¿¬±¸ÀÚ¿Í ÀÏ¹Ý ±¸¸Å °í°´Àº ±âÁ¸ Ç¥ÁØ °ø±Þ¹æ½ÄÀ» ÀÌ¿ëÇÕ´Ï´Ù.

    Researcher Support Center

    Technical Supportsales@e-taekwang.com
    Customer Center02-421-8280

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    (ÁÖ)ű¤±³¿ª ±â¼úÇù·Â ¿¬±¸¼¾ÅÍ

    (ÁÖ)ű¤±³¿ª °í¼øµµ ¹ÝµµÃ¼ ½Ä°¢¾×(Etchant) ±â¼ú µ¥ÀÌÅÍ ¼¾ÅÍ

    ű¤±³¿ªÀº ¹ÝµµÃ¼, µð½ºÇ÷¹ÀÌ, ³ª³ë ¼ÒÀç °øÁ¤À» À§ÇÑ ÃÖÀûÀÇ ¿¡ÃµÆ® ¼Ö·ç¼ÇÀ» Á¦°øÇÏ¸ç °í¼øµµ ±×·¡ÇÉ(Graphene), ź¼Ò³ª³ëÆ©ºê(CNT), Àº ³ª³ë¿ÍÀ̾î(Ag Nanowire), ¾çÀÚÁ¡(Quantum Dot) µî ³ª³ë ¼ÒÀçÀÇ ºÐ»ê(Dispersion) ¹× ÇÕ¼ºÀ» Àü¹®À¸·Î ÇÕ´Ï´Ù. ½ÇÇè½Ç ±Ô¸ð(Lab-scale)ºÎÅÍ ÆÄÀÏ·µ »ý»ê±îÁö ´ëÀÀ °¡´ÉÇÑ ±â¼ú µ¥ÀÌÅ͸¦ º¸À¯Çϰí ÀÖÀ¸¸ç, ³ª³ë ¼ÒÀç Àü»ç °øÁ¤ ¹× ÄÚÆÃ ÃÖÀûÈ­¸¦ À§ÇÑ Ä¿½ºÅÒ TDS¸¦ Áö¿øÇÕ´Ï´Ù.

    Ÿ°Ù ±Ý¼Óº° ½Ä°¢ ¼Ö·ç¼Ç

    ±â¼ú Áö¿ø µ¥ÀÌÅÍ (Technical Data Support)

    ¸ðµ¨º° ½Ä°¢ ¼Óµµ(Etch Rate), ÀÌÁ¾ ±Ý¼Ó °£ ¼±Åúñ(Selectivity Matrix), TDS ¹× MSDS ±â¼ú ÀÚ·á Á¦°ø.

    ¿¬±¸¿ë »ùÇà ½Åû ¹× °øÁ¤ ¿Âµµ, µÎ²²¿¡ µû¸¥ ¸ÂÃãÇü ±â¼ú »ó´ã (sales@e-taekwang.com)