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Application-Based Product Selection
Target ¸·Áú°ú °øÁ¤ ¸ñÀûÀ» ±â¹ÝÀ¸·Î ÀûÇÕÇÑ Etchant¡¤Cleaning Solution¡¤Advanced Materials ¹× °ü·Ã ºÎǰ¡¤Àåºñ¸¦ Á¦¾ÈÇÕ´Ï´Ù. Ãʱ⠿¬±¸ ´Ü°è¿¡´Â ¸ÂÃãÇü Á¦Ç° ¼±Á¤°ú ¼Ò·® R&D Starter KitÀ» Áö¿øÇÕ´Ï´Ù.
´ëÇ¥°ªÀÌ¸ç ½ÇÁ¦ ½Ä°¢¼Óµµ´Â ¸·Áú¡¤¿Âµµ¡¤³óµµ¡¤±³¹Ý Á¶°Ç¿¡ µû¶ó ´Þ¶óÁú ¼ö ÀÖ½À´Ï´Ù.
¡Ø ´ëÇ¥ Àç·á ȣȯ¼º Á¤º¸ÀÌ¸ç ½ÇÁ¦ °á°ú´Â ¸·Áú ¹× °øÁ¤Á¶°Ç¿¡ µû¶ó ´Þ¶óÁú ¼ö ÀÖ½À´Ï´Ù.
APPLICATION
Á¦Ç°¸íÀÌ È®Á¤µÇÁö ¾Ê¾Æµµ Target film, underlayer, °øÁ¤ ¸ñÀû°ú ¿ä±¸ Ư¼ºÀ» ±âÁØÀ¸·Î Á¦Ç° ¼±Á¤°ú Ãʱ⠰øÁ¤Á¶°ÇÀ» °ËÅäÇÕ´Ï´Ù.
Etch Rate, Uniformity, Undercut¸¦ °í·ÁÇÑ ±Ý¼Ó ¹Ú¸· ÆÐÅÍ´×.
Target/Underlayer Á¶ÇÕ, Selectivity ¹× Àç·á ȣȯ¼º °ËÅä.
°øÁ¤ ÈÄ Residue, Particle ¹× Ç¥¸é ¿À¿° Àú°¨ ¼Ö·ç¼Ç.
Roughness, Surface Quality¿Í °øÁ¤ ¾ÈÁ¤¼º °ËÅä.
R&D SUPPORT ¡¤ NEW
Wet EtchingÀ» óÀ½ ½ÃÀÛÇϰųª ¼Ò·® ÃÊ±â Æò°¡°¡ ÇÊ¿äÇÑ ¿¬±¸ÀÚ¸¦ À§ÇÑ °£Æí ¿¬±¸Áö¿ø KitÀÔ´Ï´Ù.
¹Ýº¹ »ç¿ë ¿¬±¸ÀÚ¿Í ÀÏ¹Ý ±¸¸Å °í°´Àº ±âÁ¸ Ç¥ÁØ °ø±Þ¹æ½ÄÀ» ÀÌ¿ëÇÕ´Ï´Ù.